THERMAL CPU PASTE COMPOUND/.
General
| Altele | Material: Silicone Compounds 50%, Carbon Compounds 30%, Metal Oxide Compounds 20% |
| Cantitate | 1.5 g |
| Caracteristici | Specific Gravity: >1.7 la 25 Grade C Evaporation: <0.001% la 150 Grade C/24 Ore |
| Conductivitate termica | >1.93 W/m-K |
| Temperaturi limita | -30 Grade C / +180 Grade C |
| Tip pasta | Termoconductoare |